HP-ABox(DS,SST)-180 Shrink Terminal and Solder Seal Sleeve

■ Application: HP-ABox(DS,SST)-180 is Assorted Plastic Box of HP-DS.It is customized minipacking, mainly for MRO (Mainterance Repairness Operation ) market.The heat shrinkable tubing made by polyolefin, with adhesive lining for protecting splices from water and corrosion. Providing strain relief...

Product details

■ Application:
HP-ABox(DS,SST)-180 is Assorted Plastic Box of HP-DS.It is customized minipacking, mainly for MRO (Mainterance Repairness Operation ) market.The heat shrinkable tubing made by polyolefin, with adhesive lining for protecting splices from water and corrosion. Providing strain relief and against vibration in rugged environments, which excellently insulates and protects electronic connections. It offer long-term performance, easy installation, and a low installed cost, which is more reliable than conventional crimp terminals.
HP-ABox(DS,SST)-180 is Assorted Plastic Box of HP-SST.It is customized minipacking, mainly for MRO (Mainterance Repairness Operation ) market.Transparent insulation sleeve provides encapsulation,inspect, strain relief, and insulation.Pre-fluxed solder provides controlled soldering process.One piece design, it consists of transparent heat shrinkable sleeve and fluxed solder. Provides insulation and lower the installed cost. Color hot-melt glue on two ends of heat shrinkable tube, connecting wires to component terminals, such as motor tabs, connector pins, and switch terminals,it is very convenience to use the exact wire dimension.
■ Characteristics:
HP-DS:

●Shrink ratio 3:1
●Excellent conductivity property
●High transparency 、High tensile strength
●Excellent stretch and mechanical damage resistance
●High elasticity keeps steady performance
●Water proof and moisture resistance
●Operating temperature :-55 ℃ ~ 125℃
●Minimum shrink temperature:80℃
●Minimum fully recovery temperature:130℃
HP-SST:
●Shrinkage ratio 2:1
●Waterproof for wiring splices
●Transparent sleeve provides precise inspection
●Easy control soldering process
●Minimum Shrink Temp. 60℃
●Minimum Fully Recover Temp.110℃
●Fully melt temperature of solder: 138℃

■ Technical Data:
HP-DS:

Test ItemCharacteristicsTest condition
UnagedTensile strengthMin. 16MPaRoom temp
ElongationMin.200%
AgedTensile strengthMin. 11.5MPa158℃/7 days
ElongationMin. 100%

Voltage withstand and breakdown

Voltage(Unaged)

Withstand 2.5KV for 1 minute and breakdownRoom temp.
Voltage withstand and breakdown 

Voltage(Unaged)
Withstand 2.5KV for 1 minute and breakdown at least half of unaged breakdown voltage158℃/7 days
Copper corrosionNo corrosion of bare copper158℃/7 days
Copper stabilityNo sign of degradation Min. Elongation 100%158℃7 days
Cold bendNo crack-30℃/4 hrs
Maximum secant modulus (2%)250MPa-
Volume resistivityMin. 1014Ω-cm-
Heat shockNo crack250℃/4 hrs

■ Technical Data:
HP-SST:

Operating temperature-55℃~125℃
voltage Resistant>600V
Protection typeIP67
Volume Resistivity (Ω cm)≥10 15
Dielectric Strength (KV/mm)≥25

Size:


No.
Part No.DetailsColorPCS/ Set
1HP-ABox(DS,SST)-180HP-DS-06-0.5Yellow15
2HP-DS-06-1.25Red30
3HP-DS-06-2Blue30
4HP-DS-06-5.5Yellow15
5HP-SST-105-01White15
6HP-SST-105-02Red30
7HP-SST-105-03Blue30
8HP-SST-105-04Yellow15
TOTAL180

Other sizes are available upon request.
■Color:
Standard color: White,Red, Blue,Yellow.




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